Thursday, March 30, 2017


The Actelis Networks ML230 aggregation switch delivers high speed Carrier Ethernet 2.0 services
using bonded G.SHDSL and VDSL2 (future) transmission technologies. It is a high density hardened 
chassis based platform featuring a modular design with advanced redundancy protection schemes,and 
is suitable for deployment in medium to small COs or remote cabinets.

The ML230 is a carrier class 2 RU high, 3 slot environmentally hardened platform. It supports 32 to
128 copper pairs (64 pairs/RU) and up to 128 customers (links) per chassis. ML230 can bond up to 
32 pairs per link. ML230 interface slots can be equipped with one SDU (control, switching and 
aggregation) module card, and up to 2 MLU (modem) access cards.

ML230 incorporates Actelis’ EFMplus and DRB technologies allowing carriers to offer higher 
bandwidth per pair and longer reach per service in real world environments along with the most stable 
and reliable transmission links in the industry. ML230 aggregation switches offer advanced clock 
transmission mechanism to ensure best clock accuracy and reliability over copper or fiber networks.

ML230 offers a very cost effective and rapidly deployable solution for Ethernet services and Ethernet
transport applications. MEF CE 2.0 certification enables easy integration into existing carrier/enterprise
networks, supporting advanced Ethernet features along with comprehensive OA&M capabilities and
guaranteed spectral compliance.  ML230 simplifies deployment, provisioning and troubleshooting to
enable high service availability and reliability, as well as efficient pro-active management tools to
optimize time to market and minimize service downtime.

ML230 can be flexibly deployed in Point-to-Multi-Point(PTMP), Point-to-Point (PTP) or Drop and
Continue scenarios with Actelis ML600/ML500 and ML700 (future) EADs. Actelis’ XR239 repeaters 
can be used to extend reach and rate of services offered off the ML230.

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